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Microscopic Wafer AOI Machine

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EWS 300

Key features of EWS 300 Microscopic wafer AOI:

  • Handles wafer sizes up to 300mm

  • Detecting wafer cosmetic defect , measurement , probe mark and etc.

  • SECS/GEM support

  • Minimum defect detection is 1 um

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EDS 15

Key features of EDS-15 Die Sorter:

  • Handles wafer sizes up to 300mm

  • Machine throughput up to 20,000 UPH

  • Ability to handle die size of 04×02 mm or larger

  • SideWall Inspection capability with Estek proprietary special design lighting