Features :
Product business Automotive , Semiconductor , E-Mobility , Aerospace/Defence and Others
Bond diameter 0.7 – 3 mill for fine wire , 4 – 20 mil for heavy wire
Bond type Fine wire, Deep Access, Heavy wire, Ball wedge and laser
Flexible 360 degree bond head movement.
Technology Bond force control, Pull test after wire, Inspection after wire.
Development TCO (Total cost of ownership) consultation